PRIMARY POLISHING PAD – Unfilled
The LP-57C is an unfilled, small pore size polyurethane pad. (modified version of LP-57) It is designed for silicon wafer primary polishing but has proven suitable for general polishing applications at moderate or higher pressures.
Very stable performance
Low edge roll-off
Low noise and vibration
LP-57C PAD PROPERTIES (Average)
DENSITY [g/cm³ (lb/ft³)]: 0.53 (33.0)
HARDNESS (Shore A): 88
COMPRESSIBILITY (%): 8.0
ELASTIC REBOUND (%): 92
Values are subject to change without notification.