LP-57

PRIMARY POLISHING PAD – Unfilled

The LP-57 is an unfilled, small pore size polyurethane pad.
It is designed for silicon wafer primary polishing but has proven suitable for general polishing applications at moderate or higher pressures.

BENEFITS

Short break-in period

TYPICAL APPLICATIONS

Semiconductor wafers, primary polishing, Sapphire, final polishing, Precision Optics,
Quartz, Glass, primary & single step polishing, Metals, single step polishing,
CMP-Titanium, Alumina

LP-57 PAD PROPERTIES (Average)

FILLER

DENSITY [g/cm³ (lb/ft³)]

HARDNESS (Shore A)

COMPRESSIBILITY (%)

ELASTIC REBOUND (%)

None

0.51 (32.0)

88

7.6

92

FILLER: None

DENSITY [g/cm³ (lb/ft³)]: 0.51 (32.0)

HARDNESS (Shore A): 88

COMPRESSIBILITY (%): 7.6

ELASTIC REBOUND (%): 92

Values are subject to change without notification.