SEMICONDUCTOR POLISHING PAD – Unfilled
ESM-U is used for polishing single crystal silicon carbide, and titanium CMP.
BENEFITS
Superior flatness for titanium CMP processes
TYPICAL APPLICATIONS


Sapphire
CMP-Titanium
Silicon Carbide Crystal
ESM-U PAD PROPERTIES (Average)
FILLER |
DENSITY |
HARDNESS |
COMPRESSIBILITY |
ELASTIC REBOUND |
None |
0.70 (44.0) |
46 |
7.5 |
93 |
Values are subject to change without notification.