ESM-U

SEMICONDUCTOR POLISHING PAD – Unfilled

ESM-U is used for polishing single crystal silicon carbide, and titanium CMP.

BENEFITS

Superior flatness for titanium CMP processes

TYPICAL APPLICATIONS

Sapphire
CMP-Titanium
Silicon Carbide Crystal

 

ESM-U PAD PROPERTIES (Average)

FILLER

DENSITY
[g/cm³ (lb/ft³)]

HARDNESS
(Shore D)

COMPRESSIBILITY
(%)

ELASTIC REBOUND
(%)

None

0.70 (44.0)

46

7.5

93

Values are subject to change without notification.