ESM-U

SEMICONDUCTOR POLISHING PAD – Unfilled

ESM-U is used for polishing single crystal silicon carbide, and titanium CMP.

BENEFITS

Superior flatness for titanium CMP processes

TYPICAL APPLICATIONS

Sapphire
CMP-Titanium
Silicon Carbide Crystal

ESM-U PAD PROPERTIES (Average)

FILLER

DENSITY [g/cm³ (lb/ft³)]

HARDNESS (Shore D)

COMPRESSIBILITY (%)

ELASTIC REBOUND (%)

None

0.70 (44.0)

46

7.5

93

FILLER: None

DENSITY [g/cm³ (lb/ft³)]: 0.70 (44.0)

HARDNESS (Shore D): 46

COMPRESSIBILITY (%): 7.5

ELASTIC REBOUND (%): 93

Values are subject to change without notification.