ESM-013

SEMICONDUCTOR POLISHING PAD – Unfilled

ESM-013 is an unfilled semiconductor polishing pad.

BENEFITS

High stock rate with dense ceramics

TYPICAL APPLICATIONS

Precision Optics
Silicon
Semiconductor Substrate

ESM-013 PAD PROPERTIES (Average)

FILLER

DENSITY [g/cm³ (lb/ft³)]

HARDNESS (Shore A)

COMPRESSIBILITY (%)

ELASTIC REBOUND (%)

None

0.59 (37.0)

88

9.3

93

FILLER: None

DENSITY [g/cm³ (lb/ft³)]: 0.59 (37.0)

HARDNESS (Shore A): 88

COMPRESSIBILITY (%): 9.3

ELASTIC REBOUND (%): 93

Values are subject to change without notification.