M-25
PRIMARY POLISHING PAD – Unfilled
The M-25 is an unfilled, small pore size polyurethane pad. (Modified version of LP-57)
It is designed for reduced defects during silicon wafer primary polishing.
BENEFITS
High stock removal rate
Low pad wear
Low defect level
TYPICAL APPLICATIONS
Sapphire, Silicon
M-25 PAD PROPERTIES (Average)
FILLER: None
DENSITY [g/cm³ (lb/ft³)]: 0.42 (26.0)
HARDNESS (Shore A): 89
COMPRESSIBILITY (%): 7.5
ELASTIC REBOUND (%): 90
Values are subject to change without notification.
